Current Technology Capability and Future Development
Process Capability
 Feature ( all dim. in mm ) Current Process Capability  Future Development
 Standard  Advanced*
Max. Layer Count 2-16 18-24 26-36
Max. Aspect Ratio (PTH) 8:1 10:1 12:1++
Min. Drill Size (PTH) 0.3 0.25 0.2
Min. Board Thickness 0.5 0.4 0.3
Max. Board Thickness 1.6-2.0 2.4-3.8 4.0-5.0
Min. Core Thickness 0.1 0.063 0.05
Min. Prepreg Thickness 0.075 0.05 -
Min. Copper Foil Thickness 0.5 oz 0.33 oz 0.25 oz
Max. Copper Foil Thickness 2 oz 4 oz 5-12 oz
Min. Innerlayer Line / Space 0.125/0.125 0.75/0.10 0.050/0.050
Min. Outerlayer Line & Space 0.125/0.125 0.075/0.10 0.075/0.075
Min. Pad dia. for tangency (Drill + x) 0.25 0.2 0.15
Press Fit Hole Size Tol. (+/-) 0.075 0.05 0.04
Drill Registration Tol. ( +/-) 0.075 0.05 -
Image Registration Tol. (+/-) 0.075 0.05 0.0375
Soldermask Registration Tol. (+/-) 0.075 0.05 0.025
Rout / Scoring Tol. (+/-) 0.125 0.1 0.075
Impedance Single Ended Tol. (+/-) 10% 7% 5%
Impedance Differential Tol. (+/-) 10% 7% 5%
Warp and Twist 1% 0.50% 0.50%
Heigh Density Interconnect (HDI)
 Feature ( all dim. in mm ) Current Process Capability  Future Development
 Standard  Advanced*
Mechanical drill Blind Via hole size 0.3 0.25 0.15
HDI Dielectric material Laser Drill FR-4 Laser Drill FR-4 -
Laser Blind Via hole size 0.15-0.20 0.125-0.25 0.10-0.30
Min. Target / Capture Pad diameter 0.3 0.25 0.2
Max. Laser Blind Via Depth 0.063 0.125 0.15
Max. Laser blind via Aspect Ratio 0.7 1 1.2
Sequential Lamination - Yes Yes
HDI Type Construction Type I Type I, II, III Yes
Build Up Layers - 2-N-2, Staggered 3-N-3, Stacked
Copper Fill Plating for Stacked Vias - No Yes
Materials
 Feature Current Process Capability  Future Development
 Standard  Advanced*
FR-4 Tg 135, 145,170 'C Tg 180 'C Tg 200 'C
Halogen Free No Laminate / Soldermark -
CAF Resistant Laminate No Yes -
FR-4 High Thermal Resistance No Lead Free -
Soldermask, E-Spray + Printing Taiyo PSR-4000 Probimer 77 Mask web spacing
Via Filler Peters SD 2361 Yes Yes Conductive Filler
Peelable mask Peters SD 2954 Yes Yes -
Carbon Ink ( Tamura , Electra ) Yes Yes -
Hard Gold (edge connectors) Yes Yes -
OSP Entek Cu106HT Yes -
HASL Lead Free HAL Yes -
Immersion Gold Yes Yes -
Immersion Tin ( Stannatech ) Yes Yes -
Immersion Silver ( Sterling ) Yes Yes -
Special Process Offerings
 Feature Current Process Capability  Future Development
 Standard  Advanced*
Thermal Heat Sink Attach No Yes - low flow prepreg adhesive
Via In Pad Technology No Yes conductive link
Thermal Conductive Ink No Yes -
Embedded Capacitance No No evaluation
Buried Resistors No No evaluation
Punch Fabrication Yes Yes -
    *NOTE :
1.) Advanced Process Capability requires additional process steps and/or special materials / processing.
2.) Advanced Process Capability will have limitied production output and cost adders.
3.) Orders deemed to fall under the advanced capability will be managed by the NPI Engineering Team