KCE is dedicated to creating more
environmentally friendly products without
compromising quality, at KCE we care!

Today's advances in PCB manufacturing technology include addressing certain design and manufacturing processes and their impact on the environment. Environmental and public health concerns are driving tougher legislation to restrict the use of lead in electronic devices. KCE, like other responsible members of our industry is working hard with our customers and raw material suppliers to move to viable alternatives to lead based HASL such as lead free solder, immersion Tin, and the use of organic coatings such as Entek.

In others areas we are either exploring or have introduced items such as halogen free resin material, polymer thick film carbon(Carbon Card Contacts replacing conventional nickel/gold contacts and thus removing the hazardous nickel/gold plating solution) and the replacement of feed & bleed systems for oxidizing cupric chloride etching with an electrolytic regeneration system.

• Lead-Free Products
Electroplated Pure Tin For Etch Resist
Replacement of electrolytic tin-lead plating with tin plating solution;

— Restin PC, Macdermid
— Stannous Sulphate(SnSO4)
KCE implemented the electrolytic Tin-plating process into production in 1998.

• Lead Free solder alternatives
Immersion Tin.

With input from customers KCE is evaluating Immersion Tin processes such as Atotech's "Stannatech" as an alternative surface finish to HASL.
This and other alternative finishes give the added benefits as follows:

— Lead-free finish
— Uniformity, flat and dense surface finish that permits fine-pitch application.

Non-toxicity with regard to the assembler's solder pot and lead free assembly.
— Long-term solderability and excellent wettability.
— Long shelf life.

• Halogen Free Material
The base material of most commercial PWBs is copper clad glass-epoxy laminate.
The epoxy resin used is bisphenol a brominated epoxy resin. We are currently evaluating an epoxy base material (thin core TLC-555 / prepreg TLP-555) from Toshiba, which utilizes an epoxy modification technique formulated with a nitrogen-phosphorus compound as a flame-retardant instead of employing halogenated flame-retardants and antimony.